TSMC starts mass production of 40 nm chips

The manufacturer of semiconductors TSMC said in a statement today have started mass production of chips engraved in 40 nanometers.


Originally planned for the second quarter of 2008, the two etching processes had finally been delayed. The ramps production using 40 nanometer processes General Purpose (40G) and Low Power (40LP) respectively to produce powerful chips (graphics cards, game consoles, storage) on the one hand and chips at low consumption of other (telephony, wireless communications), are open.A third said LPG process, proposing a compromise of the first two selected by manufacturers of graphics cards, will soon emerge.

In comparison, the latest processors from Intel and AMD are engraved in 45 nanometers while most graphics cards latest generation involves a fine engraving of 55 or 65 nanometers.NVIDIA and ATI (a division of AMD) are rightly call for TSMC to produce its graphics chips.

Etching finer allows components to produce more profitable, less energy and more compact. The decrease in this fine engraving is at the heart of the concerns of designers and manufacturers of chips for a few years. AMD also said a few days ago consider launching production of chips engraved in 32 nanometers in 2011, while Intel plans to market by 2009. The first chips etched in 40 nm TSMC is expected to be marketed early in the year 2009.

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